-
BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO
Source: Buzz FX / 03 Jul 2026 01:21:19 America/New_York
-
Jul 3, 2026, 12:48 am10 ptsDigitimesBOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company recently disclosed that it has formed a dedicated project team
Read more...